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Max Layer Count38 Layers (Details)
Max Board thickness (mm)4.5mm ( 0.177”)  (Details)
Min Board Thickness (mm)0.25mm to 0.8mm   (Details)
Max PCB Size 16 x 22” ( 406.4 x 558.8 mm)  (Details)
Min. Mechanical drill size (mm )0.250mm (drill) - finished size 0.20mm
Max. Aspect ratio10:1
Min. line/ space(mil)3.5mils
Impedance control ( % )+/-10%
Max. CU thickness, Inner layer (oz)70 microns standard, 105 microns on request
Max. CU thickness, Outer layer (oz)105 microns start
Min .Laser drill Size ( Micron)100 microns
Min Hole / Pad Size (mil)8mil / 18mil
Min. AR for micro via ( Micron )3mils
Surface FinishHASL with Leaded ; ENIG (Metal Finishing) ; Hard Gold ; Selective Hard gold ; Immersion Silver;
Via FillingYes  (Details)
Microvia hole filling technologyYes  (Details)
HDI(Blind/Burried)Yes  (Details)
Edge Plating / CastellationYes  (Details)
Depth control cavityYes  (Details)
Back DrillingYes  (Details)
Performance Class IPC-Class-2, Class-3, Class-3A, JSS 52302, ISRO PAX 304 and customer QAP
Solder MaskGreen ; Blue ; Red
Silk screenWhite with option of serial number printing
V-GrooveStandard / Jump scoring
UL ApprovalYes, File number E156972
ROHS/REACH Compliance Yes – Except leaded HASL Finish
Schedule Min 4 Working Days
Metal Bonding PCB Yes  (Details)
High Tg/ Td170/260, FR4 High Tg, Arlon 35N , Polyimide , Megtron, others are available, need to discuss
Low Dk / DfYes, Rogers 4000, 5000 and 6000 series, FR408, Tachyon, ITEQ168G,others are available, need to discuss
Mixed dielectric Yes